Removable heat management for recharge coils

ABSTRACT

Devices, systems, and techniques for managing heat generated in coils for wireless energy transmission are disclosed. Inductive coupling between two coils (e.g., a primary coil and a secondary coil) may be used to recharge the power source of an implantable medical device. A phase change material may be thermally coupled to the primary coil to absorb heat generated during the inductive coupling and reduce temperature increases of the primary coil. In one example, the phase change material may be configured to absorb heat from an energy transfer coil. A housing may be configured to contain the phase change material and a coupling mechanism may be configured to removably attach the housing to the energy transfer coil.

This application is a continuation of U.S. patent application Ser. No.13/284,680 filed on Oct. 28, 2011, the entire content of which isincorporated herein by reference.

TECHNICAL FIELD

The disclosure relates to wireless power transfer for implantablemedical devices and, more particularly, to heat management in powertransfer coils.

BACKGROUND

Implantable medical devices may be used to monitor a patient conditionand/or deliver therapy to the patient. In long term or chronic uses,implantable medical devices may include a rechargeable power source(e.g., one or more capacitors or batteries) that extends the operationallife of the medical device to weeks, months, or even years over anon-rechargeable device.

When the energy stored in the rechargeable power source has beendepleted, the patient may use an external charging device to rechargethe power source. Since the rechargeable power source is implanted inthe patient and the charging device is external of the patient, thischarging process may be referred to as transcutaneous charging. In someexamples, transcutaneous charging may be performed via inductivecoupling between a primary coil in the charging device and a secondarycoil in the implantable medical device.

An electrical current applied to the primary coil generates a magneticfield, and when the primary coil is aligned to the secondary coil, themagnetic field induces an electrical current in the secondary coilwithin the patient. A charging circuit within the implantable medicaldevice then applies current from the secondary coil to charge therechargeable power source within the implantable medical device. Withtranscutaneous transfer via inductive coils, the external chargingdevice does not need to physically connect with the rechargeable powersource for charging to occur.

SUMMARY

In general, the disclosure is directed to devices, systems, andtechniques for managing heat generated in coils for wireless energytransmission to implantable medical devices. Inductive coupling betweentwo coils (e.g., energy transfer devices) may be used to recharge thepower source of an implantable medical device. A primary coil remainsexternal to the patient and a secondary coil may be implanted with theimplantable medical device. A phase change material may be thermallycoupled to the primary coil to absorb heat generated during theinductive coupling and reduce temperature increases of the primary coil.A coupling mechanism may be provided to removably attach a housingcontaining the phase change material with the primary coil. In someexamples, the phase change material may be contained within thermallyconductive tubes or channels configured in shapes that promoteflexibility of the housing and contact with the primary coil.

In one aspect, the disclosure is directed to a device that includes aphase change material configured to absorb heat from an energy transfercoil, a housing configured to contain the phase change material, and acoupling mechanism configured to removably attach the housing to theenergy transfer coil.

In another aspect, the disclosure is directed to a device that includesmeans for absorbing heat from an energy transfer coil, means forcontaining the means for absorbing heat, and means for removablyattaching the housing to the energy transfer coil.

In a further aspect, the disclosure is directed to a system thatincludes an energy transfer coil configured to recharge a rechargeablepower source of an implantable medical device and a housing containing aphase change material and configured to be removably attached to theenergy transfer coil, wherein the phase change material is configured toabsorb heat from the energy transfer coil.

In a further aspect, the disclosure is directed to a method thatincludes removably attaching a housing to an energy transfer coil,wherein the energy transfer coil is configured to recharge arechargeable power source of an implantable medical device and thehousing contains a phase change material configured to absorb heat fromthe energy transfer coil.

The details of one or more examples are set forth in the accompanyingdrawings and the description below. Other features, objects, andadvantages will be apparent from the description and drawings, and fromthe claims.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a conceptual diagram illustrating an example system thatincludes an implantable medical device (IMD) and an external chargingdevice that charges a rechargeable power source of the IMD via an energytransfer coil.

FIG. 2A is a conceptual diagram of an example wound wire of an energytransfer coil.

FIG. 2B is a conceptual diagram of an example energy transfer coil ofFIG. 1 and conformable housing containing a phase change material inconjunction with a non-planar surface.

FIGS. 3A and 3B are cross-sectional top and side views of phase changematerial disposed in a phase change material spiral in conjunction withan energy transfer coil.

FIGS. 4A and 4B are cross-sectional top and side views of a phase changematerial disposed in a plurality of concentric rings in conjunction withan energy transfer coil.

FIGS. 5A and 5B are cross-sectional top and side views of a phase changematerial disposed inside an inner diameter and outside an outer diameterof an energy transfer coil.

FIGS. 6A, 6B, and 6C are cross-sectional top and side views of a phasechange material disposed in a disk-shaped volume in conjunction with anenergy transfer coil.

FIGS. 7A and 7B are cross-sectional side views of a phase changematerial disposed on one side and on an opposing side of an energytransfer coil.

FIGS. 8A and 8B are cross-sectional side views of a phase changematerial disposed in a radial zigzag pattern in conjunction with anenergy transfer coil.

FIGS. 9A and 9B are cross-sectional side views of a phase changematerial disposed in a lateral zigzag pattern in conjunction with anenergy transfer coil.

FIGS. 10A and 10B are cross-sectional side views of a phase changematerial disposed in a plurality of self-contained volumes distributedin conjunction with an energy transfer coil.

FIGS. 11A and 11B include a top view and a cross-sectional side view ofa heat sink device removably attached to an energy transfer coil with athreaded member.

FIGS. 12A and 12B include a top view and a cross-sectional side view ofa heat sink device removably attached to an energy transfer coil withtwo retaining members.

FIGS. 13A and 13B include a perspective view and a cross-sectional sideview of a heat sink device removably attached to an energy transfer coilwith an elastic sheath.

FIGS. 14A and 14B include a top view and a side view of a heat sinkdevice removably attached to an energy transfer coil in conjunction withskin of a patient.

FIGS. 15A and 15B include a top view and a cross-sectional side view ofa heat sink device removably attached to an energy transfer coil with anelastic sheath.

FIGS. 16A and 16B include a top view and a cross-sectional side view ofa heat sink device removably attached to an energy transfer coil with aretaining member.

DETAILED DESCRIPTION

This disclosure is generally directed to devices, systems, andtechniques for managing heat generated in coils during wireless energytransfer. Typically, inductive coupling, or other wireless energytransfer techniques, may be used to recharge batteries of implantablemedical devices (IMDs) and/or transmit information. Inductive couplingmay utilize a primary coil of the external charging device to transmitthe energy and a secondary coil of the IMD to transcutaneously receivethe energy from the primary coil. As an electrical current is generatedwithin the primary coil, the primary coil may increase in temperature,e.g., due to the resistance of the coil. Since the primary coil, and thesecondary coil in some examples, may be placed directly against or inclose proximity to the skin of the patient, an increase in coiltemperature may become uncomfortable for the patient. The coil may beexternal of the housing of the charging device, or in other examples,the coil may be within the housing of the charging device. The secondarycoil of the IMD, however, may be implanted within the patient whetheroutside or inside of the IMD housing. Not only may these temperatures beuncomfortable, but some patients may prematurely terminate therecharging process or even avoid recharging. Furthermore, some primarycoils may be rigid and uncomfortable when forced against the skin of thepatient. In other words, the skin of the patient may be deformed by theprimary coil during the recharging process, causing discomfort.

As disclosed herein, a heat sink device may generally be removablyattached to a primary coil (e.g., an energy transfer coil) used inwireless energy transfer. The heat sink device may include a housingthat contains a phase change material configured to absorb heatgenerated by the energy transfer coil. The removable heat sink devicemay include a coupling mechanism that facilitates attachment of the heatsink device to the energy transfer coil. For example, the couplingmechanism may include a threaded structure, a retention member, anelastic sheath, or a strap configured to maintain contact between thehousing of the heat sink device and the housing of the energy transfercoil. In this manner, the material of both housings may facilitatethermal transfer from the wire of the energy transfer coil to the phasechange material within the heat sink device.

The removable feature of the heat sink device may allow a user to addthe heat sink device for any time the energy transfer coil may increasein temperature. In other examples, the heat sink device may beconfigured such that the user may exchange a used (e.g., heated) heatsink device for a new (e.g., cool) heat sink device during a chargingsession. The heat sink device may thus be used during every chargingsession of the IMD or only when needed to manage temperature of theenergy transfer device. In some examples, the heat sink device andcorresponding energy transfer coil may each be constructed to matetogether. Alternatively, the heat sink device may be constructed as anaftermarket product to mate with a pre-existing energy transfer coil.The heat sink device may be a permanent, multi-use device that can beused repeatedly by the user. In other examples, the heat sink device maybe a single use device, or a limited use device, that is disposableafter the user has completed one or more recharge sessions.

In some examples, the heat sink device and contained phase changematerial may be configured to be flexible and deformable so as toconform to at least a portion of an energy transfer coil configured todeform (e.g., a flexible coil). The flexible coil may conform tonon-planar skin surfaces of the patient, and the phase change materialmay absorb heat generated by the flexible coil. The flexible coil mayinclude insulated wire wound in an in-plane spiral. This in-plane spiralmay provide a relatively thin coil that can conform to non-planarsurfaces to increase comfort to the patient. The flexible coil may beencased by a flexible housing that protects the flexible coil while alsoallowing the in-plane spiral of wire to bend and flex out of a singleplane. As described herein, the energy transfer coil may be either rigidor flexible. In either case, the heat sink device may be configured toremovably attach to the energy transfer coil.

The phase change material generally acts as the heat sink for heatgenerated by the electrical current in the energy transfer coil. Theheat from the energy transfer coil may contribute to the heat of fusionof the phase change material as the phase change material changes from asolid state to a fluid state. During this phase change, the materialdoes not increase in temperature and enables the energy transfer coil toremain at lower temperatures for a longer period of time than otherwisewould be possible. In other words, heat generated in the energy transfercoil may be absorbed by the phase change material during the change inphase to limit temperature increases in the energy transfer coil.Example phase change materials may include paraffin waxes (e.g.,N-eicosane), fatty acid esters, or other materials with a relativelyhigh heat of fusion and melting points at temperatures appropriate forpatient use.

The phase change material may be contained within a housing and, in someexamples, within another containment structure (e.g., a thermallyconductive elastomer). Although the phase change material may bedisposed in a disk-shaped volume with a large surface area to be inthermal communication with the energy transfer coil, the phase changematerial may alternatively be disposed in structures, locations, orshapes selected to promote or accommodate any flexibility of the energytransfer coil. In other words, the phase change material, and the entireheat sink device, may be configured deform with the energy transfer coilor otherwise accommodate flexibility of at least a portion of the energytransfer coil. In some examples, the flexibility or deformability of theheat sink device may allow a greater surface area of the heat sinkdevice to directly contact the energy transfer coil. This increasedcontact area may promote thermal communication between the energytransfer coil and the phase change material of the heat sink device.

When in the solid state, the phase change material may not be easilydeformable. Therefore, the phase change material may be contained withinchannels, tubes, beads, or other volumes at predetermined positionswithin the heat sink device that facilitate flexibility of the heat sinkdevice. Since smaller cross-sectional thicknesses of the phase changematerial may promote greater bending (e.g., a lower moment of inertia)than larger cross-sectional thicknesses, the configuration of how thephase change material is disposed within the heat sink device may atleast partially determine the flexibility, or stiffness, of the heatsink device. In one example, the phase change material may be containedwithin a plurality of concentric rings on one side of the flexible coil.These configurations (e.g., the volume, shape, and location with respectto the flexible coil) of the phase change material may be selected toaccommodate flexibility of the energy transfer coil. In other words, thephase change material may not inhibit, or only minimally inhibit, theflexibility of the energy transfer coil when the heat sink device isremovable attached to the energy transfer coil.

The energy transfer coil may also include a flexible housing thatencases the wound wire that makes up the coil. The heat sink device maybe configured to be disposed on any side of the energy transfer coil.For example, the heat sink may be disposed on the side of the energytransfer coil proximal to patient skin. In other examples the heat sinkmay be disposed on the side of the energy transfer coil distal topatient skin or on both opposing sides of the energy transfer coil. Insome examples, the heat sink device may be configured such that thephase change material may be disposed inside the inner diameter of thein-plane spiral of the coil or outside the outer diameter of thein-plane spiral of the coil. In this manner, the heat sink device may beconfigured in a variety of different shapes that may facilitate use ofthe energy transfer coil for charging and managing the temperature ofthe energy transfer coil.

Although the energy transfer coil is generally described as the primarycoil external to the patient, the energy transfer coil could be thesecondary coil within the patient to utilize the flexibility and heatmanagement characteristics of the heat sink device described herein.However, the heat sink device may then require a biocompatible housingand removability of the heat sink device may be under-utilized. Theflexible nature of some phase change material configurations may allowthe heat sink device to be positioned within or adjacent to devices thatmay include curves or other non-planar surfaces. Portable electronicsand devices operating with minimal active cooling features may benefitfrom a heat sink device as described in this disclosure.

FIG. 1 is a conceptual diagram illustrating example system 10 thatincludes an implantable medical device (IMD) 14 and an external chargingdevice 22 that charges a rechargeable power source of the IMD 14 via anenergy transfer coil 26. Although the techniques described in thisdisclosure are generally applicable to a variety of medical devicesincluding medical devices such as patient monitors, electricalstimulators, or drug delivery devices, application of such techniques toimplantable neurostimulators will be described for purposes ofillustration. More particularly, the disclosure will refer to animplantable neurostimulation system for use in spinal cord stimulationtherapy, but without limitation as to other types of medical devices.

As shown in FIG. 1, system 10 includes an IMD 14 and external chargingdevice 22 shown in conjunction with a patient 12, who is ordinarily ahuman patient. In the example of FIG. 1, IMD 14 is an implantableelectrical stimulator that delivers neurostimulation therapy to patient12, e.g., for relief of chronic pain or other symptoms. Generally IMD 14may be a chronic electrical stimulator that remains implanted withinpatient 12 for weeks, months, or even years. In the example of FIG. 1,IMD 14 and lead 18 may be directed to delivering spinal cord stimulationtherapy. In other examples, IMD 14 may be a temporary, or trial,stimulator used to screen or evaluate the efficacy of electricalstimulation for chronic therapy. IMD 14 may be implanted in asubcutaneous tissue pocket, within one or more layers of muscle, orother internal location. IMD 14 includes a rechargeable power source(not shown) and IMD 14 is coupled to lead 18.

Electrical stimulation energy, which may be constant current or constantvoltage based pulses, for example, is delivered from IMD 14 to one ormore targeted locations within patient 12 via one or more electrodes(not shown) of lead 18. The parameters for a program that controlsdelivery of stimulation energy by IMD 14 may include informationidentifying which electrodes have been selected for delivery ofstimulation according to a stimulation program, the polarities of theselected electrodes, i.e., the electrode configuration for the program,and voltage or current amplitude, pulse rate, pulse shape, and pulsewidth of stimulation delivered by the electrodes. Electrical stimulationmay be delivered in the form of stimulation pulses or continuouswaveforms, for example.

In the example of FIG. 1, lead 18 is disposed within patient 12, e.g.,implanted within patient 12. Lead 18 tunnels through tissue of patient12 from along spinal cord 20 to a subcutaneous tissue pocket or otherinternal location where IMD 14 is disposed. Although lead 18 may be asingle lead, lead 18 may include a lead extension or other segments thatmay aid in implantation or positioning of lead 18. In addition, aproximal end of lead 18 may include a connector (not shown) thatelectrically couples to a header of IMD 14. Although only one lead 18 isshown in FIG. 1, system 10 may include two or more leads, each coupledto IMD 14 and directed to similar or different target tissue sites. Forexample, multiple leads may be disposed along spinal cord 20 or leadsmay be directed to spinal cord 20 and/or other locations within patient12. Lead 18 may carry one or more electrodes that are placed adjacent tothe target tissue, e.g., spinal cord 20 for spinal cord stimulation(SCS) therapy.

In alternative examples, lead 18 may be configured to deliverstimulation energy generated by IMD 14 to stimulate one or more sacralnerves of patient 12, e.g., sacral nerve stimulation (SNS). SNS may beused to treat patients suffering from any number of pelvic floordisorders such as pain, urinary incontinence, fecal incontinence, sexualdysfunction, or other disorders treatable by targeting one or moresacral nerves. Lead 18 and IMD 14 may also be configured to provideother types of electrical stimulation or drug therapy (e.g., with lead18 configured as a catheter). For example, lead 18 may be configured toprovide deep brain stimulation (DBS), peripheral nerve stimulation(PNS), or other deep tissue or superficial types of electricalstimulation. In other examples, lead 18 may provide one or more sensorsconfigured to allow IMD 14 to monitor one or more parameters of patient12. The one or more sensors may be provided in addition to, or in placeof, therapy delivery by lead 18.

IMD 14 delivers electrical stimulation therapy to patient 12 viaselected combinations of electrodes carried by lead 18. The targettissue for the electrical stimulation therapy may be any tissue affectedby electrical stimulation energy, which may be in the form of electricalstimulation pulses or waveforms. In some examples, the target tissueincludes nerves, smooth muscle, and skeletal muscle. In the exampleillustrated by FIG. 1, the target tissue for electrical stimulationdelivered via lead 18 is tissue proximate spinal cord 20 (e.g., one ormore target locations of the dorsal columns or one or more dorsal rootsthat branch form spinal cord 20. Lead 18 may be introduced into spinalcord 20 via any suitable region, such as the thoracic, cervical orlumbar regions. Stimulation of dorsal columns, dorsal roots, and/orperipheral nerves may, for example, prevent pain signals from travelingthrough spinal cord 20 and to the brain of the patient. Patient 12 mayperceive the interruption of pain signals as a reduction in pain and,therefore, efficacious therapy results. For treatment of otherdisorders, lead 18 may be introduced at any exterior location of patient12.

Although lead 18 is described as generally delivering or transmittingelectrical stimulation signals, lead 18 may additionally oralternatively transmit electrical signals from patient 12 to IMD 14 formonitoring. For example, IMD 14 may utilize detected nerve impulses todiagnose the condition of patient 12 or adjust the delivered stimulationtherapy. Lead 18 may thus transmit electrical signals to and frompatient 12.

A user, such as a clinician or patient 12, may interact with a userinterface of an external programmer (not shown) to program IMD 14.Programming of IMD 14 may refer generally to the generation and transferof commands, programs, or other information to control the operation ofIMD 14. For example, the external programmer may transmit programs,parameter adjustments, program selections, group selections, or otherinformation to control the operation of IMD 14, e.g., by wirelesstelemetry or wired connection.

In some cases, an external programmer may be characterized as aphysician or clinician programmer if it is primarily intended for use bya physician or clinician. In other cases, the external programmer may becharacterized as a patient programmer if it is primarily intended foruse by a patient. A patient programmer is generally accessible topatient 12 and, in many cases, may be a portable device that mayaccompany the patient throughout the patient's daily routine. Ingeneral, a physician or clinician programmer may support selection andgeneration of programs by a clinician for use by stimulator 14, whereasa patient programmer may support adjustment and selection of suchprograms by a patient during ordinary use. In other examples, externalcharging device 20 may be included, or part of, an external programmer.In this manner, a user may program and charge IMD 14 using one device,or multiple devices.

IMD 14 may be constructed of any polymer, metal, or composite materialsufficient to house the components of IMD 14 within patient 12. In thisexample, IMD 14 may be constructed with a biocompatible housing, such astitanium or stainless steel, or a polymeric material such as silicone orpolyurethane, and surgically implanted at a site in patient 12 near thepelvis, abdomen, or buttocks. The housing of IMD 12 may be configured toprovide a hermetic seal for components, such as a rechargeable powersource. In addition, the housing of IMD 12 may be selected of a materialthat facilitates receiving energy to charge a rechargeable power source.

As described herein, secondary coil 16 may be included within IMD 14.However, in other examples, secondary coil 16 could be located externalto a housing of IMD 14, separately protected from fluids of patient 12,and electrically coupled to electrical components of IMD 14. This typeof configuration of IMD 14 and secondary coil 16 may provide implantlocation flexibility when anatomical space available for implantabledevices is minimal and/or improved inductive coupling between secondarycoil 16 and primary coil 26. In any case, an electrical current may beinduced within secondary coil 16 to charge the battery of IMD 14 whenenergy transfer coil 26 (e.g., a primary coil) produces a magnetic fieldthat is aligned with secondary coil 16. The induced electrical currentmay first be conditioned and converted by a charging module (e.g., acharging circuit) to an electrical signal that can be applied to thebattery with an appropriate charging current. For example, the inductivecurrent may be an alternating current that is rectified to produce adirect current suitable for charging the battery.

The rechargeable power source of IMD 14 may include one or morecapacitors, batteries, or components (e.g. chemical or electrical energystorage devices). Example batteries may include lithium-based batteries,nickel metal-hydride batteries, or other materials. The rechargeablepower source may be replenished, refilled, or otherwise capable ofincreasing the amount of energy stored after energy has been depleted.The energy received from secondary coil 16 may be conditioned and/ortransformed by a charging circuit. The charging circuit may then send anelectrical signal used to charge the rechargeable power source when thepower source is fully depleted or only partially depleted.

Charging device 22 may be used to recharge the rechargeable power sourcewithin IMD 14 implanted in patient 12. Charging device 22 may be ahand-held device, a portable device, or a stationary charging system. Inany case, charging device 22 may include components necessary to chargeIMD 14 through tissue of patient 12. Charging device 22 may includehousing 24 and energy transfer coil 26. In addition, heat sink device 28may be removably attached to energy transfer coil 26 to manage thetemperature of then energy transfer coil during charging sessions.Housing 24 may enclose operational components such as a processor,memory, user interface, telemetry module, power source, and chargingcircuit configured to transmit energy to secondary coil 16 via energytransfer coil 26. Although a user may control the recharging processwith a user interface of charging device 22, charging device 22 mayalternatively be controlled by another device (e.g., an externalprogrammer). In other examples, charging device 22 may be integratedwith an external programmer, such as a patient programmer carried bypatient 12.

Charging device 22 and IMD 14 may utilize any wireless power transfertechniques that are capable of recharging the power source of IMD 14when IMD 14 is implanted within patient 14. In one example, system 10may utilize inductive coupling between primary coils (e.g., energytransfer coil 26) and secondary coils (e.g., secondary coil 16) ofcharging device 22 and IMD 14. In inductive coupling, energy transfercoil 26 is placed near implanted IMD 14 such that energy transfer coil26 is aligned with secondary coil 16 of IMD 14. Charging device 22 maythen generate an electrical current in energy transfer coil 26 based ona selected power level for charging the rechargeable power source of IMD14. When the primary and secondary coils are aligned, the electricalcurrent in the primary coil may magnetically induce an electricalcurrent in the secondary coil within IMD 14. Since the secondary coil isassociated with and electrically coupled to the rechargeable powersource, the induced electrical current may be used to increase thevoltage, or charge level, of the rechargeable power source. Althoughinductive coupling is generally described herein, any type of wirelessenergy transfer may be used to transfer energy between charging device22 and IMD 14.

Energy transfer coil 26 may include a wound wire (e.g., a coil) (notshown in FIG. 1). The coil may be constructed of a wire wound in anin-plane spiral (e.g., a disk-shaped coil). In some examples, thissingle or even multi-layers spiral of wire may be considered a flexiblecoil capable of deforming to conform with a non-planar skin surface. Thecoil may include wires that electrically couple the flexible coil to apower source and a charging module configured to generate an electricalcurrent within the coil. Energy transfer coil 26 may also include ahousing that encases the coil. The housing may be constructed of aflexible material such that the housing promotes, or does not inhibit,flexibility of the coil. Energy transfer coil 26 may be external ofhousing 24 such that energy transfer coil 26 can be placed on the skinof patient 12 proximal to IMD 14. In this manner, energy transfer coil26 may be tethered to housing 24 using cable 27 or other connector thatmay be between approximately a few inches and several feet in length. Inother examples, energy transfer coil 26 may be disposed on the outsideof housing 24 or even within housing 24. Energy transfer coil 26 maythus not be tethered to housing 22 in other examples.

Heat sink device 28 may be removably attached to energy transfer coil26. In examples where energy transfer coil 26 is disposed on or withinhousing 24, heat sink device 28 may be configured to be removablyattached to housing 24. Heat sink device 28 may include phase changematerial that absorbs heat generated in the energy transfer coil 26during then energy transfer process of a charging session. As chargingdevice 22 generates an electrical current within the energy transfercoil 26, the current may produce heat that increases the temperature ofenergy transfer coil 26. When energy transfer coil 26 is in closeproximity to the skin of patient 12, this increase in temperature may beuncomfortable to patient 12. In other words, energy transfer coil 26 mayfeel warm to the touch. This increase in temperature may cause patient12 to shift energy transfer coil 26 to a different location on the skin,remove energy transfer device 26 from the skin, or even discontinue ordelay the charging session. Therefore, increased temperatures fromenergy transfer coil 26 may lead to operational shortcomings of IMD 14,such as reduced operational times between charging sessions due toinadequate charging sessions, in addition to patient discomfort.

The phase change material may be included in heat sink device 28 tomanage the temperature of energy transfer coil 26. The phase changematerial may be any compound or substance selected to change phases(e.g., change from a solid state to a liquid state) at a temperaturewithin the operating temperatures of energy transfer coil 26. Generally,the melting point of the phase change material may be lower than atemperature that would be uncomfortable to patient 12. For example, thephase change material may be selected to have a melting point betweenapproximately 15 degrees Celsius and 50 degrees Celsius. Morespecifically, the phase change material may have a melting point betweenapproximately 25 degrees Celsius and 45 degrees Celsius. In anotherexample, the phase change material may have a melting point betweenapproximately 35 degrees Celsius and 43 degrees Celsius.

In one example, it may be desirable to limit the temperature of energytransfer coil 26, and the adjacent skin, to be less than or equal toapproximately 39 degrees Celsius. Therefore, the phase change materialmay be selected with a melting point at or near the desired temperaturelimit. A desired melting point of the phase change material may thus bejust below approximately 39 degrees Celsius, such as betweenapproximately 35 degrees Celsius and approximately 38 degrees Celsius.The heat of fusion of the phase change material may thus provide arelatively large heat sink that may help to limit the rise intemperature of the skin above the desired temperature limit. The mass ofthe phase change material may be selected to achieve desiredtemperatures of energy transfer device 26. With higher masses of thephase change material, energy transfer coil 26 may remain at the meltingpoint of the phase change material for longer periods of time and limitthe temperature of energy transfer coil 26. Without heat sink device 28attached to (e.g., in thermal communication with) energy transfer coil26, energy transfer coil 26 may generate undesirable temperatures.

In this manner, heat from energy transfer coil 26 may contribute to theheat of fusion of the phase change material to delay higher temperaturesin energy transfer coil 26. After the phase change material has changedto from the solid state to the liquid state, the ability of the phasechange material to act as a heat sink may be reduced. However, the phasechange material may be subjected to many cycles of changing phases.After the charging session, energy transfer coil 26 will cool along withthe phase change material. The phase change material may change back tothe solid state from the higher temperature liquid state. Subsequently,the heat of fusion of the phase change material may again function as aheat sink for energy transfer coil 26.

The amount of heat that the phase change material can absorb is alsodependent upon the type of material selected, the mass of the material,and degree of thermal communication between the wire of energy transfercoil 26 and the phase change material of heat sink device 28. Although agreater mass of material may absorb a greater amount of heat from energytransfer coil 26, heat sink device 28 may become less flexible with agreater mass of the phase change material. The phase change material maybe in thermal communication with energy transfer coil 26 when there is aminimally resistive path for heat between the phase change material andthe wound wires of energy transfer coil 26. In this manner, the phasechange material may be in thermal communication with energy transfercoil 26 when the housing of heat sink device 28 is disposed in directcontact with the housing of energy transfer coil 26 or separated fromenergy transfer coil 26 with a thermally conductive material (e.g., athermally conductive elastomer or a deformable metal alloy). The phasechange material may not be considered to be in substantial thermalcommunication with the coil when an insulator (e.g., a gas, a vacuum, ora thermally insulative material) is disposed between the phase changematerial to reduce the rate of heat transferred from the coil to thephase change material.

In some examples, two or more different types of phase change materialsmay be disposed within heat sink device 28. These different materialsmay be disposed at different locations of heat sink device 28 orcommingled across the surface of the housing. Since the differentmaterials may include different melting points and different heats offusion, the temperature profile of energy transfer coil 26 over time,when heat sink device 28 is attached, may be manipulated. In otherwords, a phase change material having a lower melting point may delaychanges in temperature at a lower temperature while a different phasechange material having a higher melting point may delay changes intemperature at a higher temperature. This temperature profile may beselected to provide a more comfortable experience for patient 12. Forexample, a specific phase change material may be selected to absorbtypical temperature spikes during energy transfer, reduce the initialtemperature rate increase during energy transfer, and/or reduce the rateof temperature increase near the end of charging sessions.

The phase change material may be selected from any variety of materialshaving properties sufficient to perform the functions described herein.For example, the phase change material may be a paraffin wax, a fattyacid, ester (carboxylic acid), inorganic materials such as salt hydratesor sodium hydrogen phosphate, or other compounds. The paraffin wax maybe a saturated alkane having between 19 and 23 carbon atoms that haveapproximate melting points in a desired range. Example paraffin waxesmay include nonadecane (C₁₉H₄₀; approximate melting point of 32.0degrees Celsius), eicosane or N-eicosane (C₂₀H₄₂; approximate meltingpoint of 36.4 degrees Celsius), heneicosane (C₂₁H₄₄; approximate meltingpoint of 40.4 degrees Celsius), docosane (C₂₂H₄₆; approximate meltingpoint of 44.4 degrees Celsius), or tricosane (C₂₃H₄₈; approximatemelting point of 47.4 degrees Celsius). In one example, the phase changematerial selected for heat sink device 28 may include eicosane. In someexamples, the phase change material may include both eicosane andheneicosane. In this manner, different phase change materials may beincluded in heat sink device 28 either in combination or at separatelocations in heat sink device 28.

The amount of phase change material included within heat sink device 28may be selected based on the power transferred by energy transfer coil26, the material of wire for the coil, the amount of time needed forenergy transfer, and the desired temperature limit for energy transfercoil 26. The mass of phase change material needed for energy transfercoil 26 may also be based on the type of material selected. Generally,heat sink device 28 may include between approximately 1.0 gram of phasechange material and 100 grams of phase change material. In one example,an heat sink device 28 may include approximately 10 grams of phasechange material for an energy transfer coil having a 10 centimeterdiameter and a thickness of approximately 4.5 millimeters.

As described herein, heat sink device 28 may include a phase changematerial configured to absorb heat from energy transfer coil 26. Heatsink device 28 may also include a housing configured to contain thephase change material. In addition, heat sink device 28 may include acoupling mechanism configured to removably attach the housing to energytransfer coil 26. Energy transfer coil 26 may include a rigid orflexible coil of wire. Energy transfer coil 26 may be configured to atleast one of transmit energy to or receive energy from secondary coil16. When heat sink device 28 is removably attached to energy transfercoil 26 (e.g., heat sink device 28 contacts energy transfer coil 26),the phase change material may be in thermal communication with at leasta portion of the coil such that the phase change material is configuredto absorb heat from the flexible coil. The phase change material (e.g.,any material selected to change phases at a temperature generated by theflexible coil) may be a means for absorbing heat from energy transfercoil 26. The housing of heat sink device 28 may be a means forcontaining the phase change material, and the coupling mechanism may beat least part of a means for removably attaching heat sink device 28 toenergy transfer coil 26. In this manner, heat sink device 28 may beselectively attachable and detachable from energy transfer coil 26.

Together, system 10 may include energy transfer coil 26 and heat sinkdevice 28. Energy transfer coil 26 may be configured to recharge arechargeable power source of IMD 14. Heat sink device 28 may include ahousing that contains a phase change material. The housing may beconfigured to be removably attached to energy transfer coil 26. In thismanner, the system may operate such that energy transfer coil 26generates heat during a recharge session and the phase change materialof heat sink device 28 absorbs at least a portion of the generated heat.When the phase change material is at the melting temperature, the heatmay contribute to the heat of fusion of the phase change material andnot to increasing the temperature of energy transfer coil 26.

The coupling mechanism may be configured to retain at least a portion ofthe housing in thermal communication with a surface of energy transfercoil 26. When the coupling mechanism is engaged, the housing of heatsink device 28 may be in thermal communication (e.g., direct contact orcontact via a thermally conductive material) with the surface of energytransfer device 28. In some examples, energy transfer coil 26 mayinclude a first portion of the coupling mechanism and heat sink device28 may include a second portion of the coupling mechanism. In otherexamples, either energy transfer coil 26 or heat sink device 28 mayinclude the entire coupling mechanism for removably attaching heat sinkdevice 28 to energy transfer coil 26. The coupling mechanism may bemolded or formed of the housing or, alternatively, attached to thehousing. In any case, the coupling mechanism may enable heat sink device28 to be attached to energy transfer coil 26 and removed from energytransfer coil 26.

In one example, the coupling mechanism may include a threaded structureof heat sink device 28 configured to mate to a threaded surface ofenergy transfer coil 26. The threaded structure may be a threaded shaftor other bolt-like structure. The threaded surface of energy transfercoil 26 may be configured to mate with the threaded structure of heatsink device 28. Although only one threaded structure and correspondingthreaded surface may be used to removably attach heat sink device 28 toenergy transfer coil 26, two or more threaded mating structures andsurfaces may be used in other examples. Alternatively, the threadedstructure of heat sink device 28 may be formed on the outercircumference of the heat sink device housing and configured to matewith a threaded surface of the housing of energy transfer coil 26. Inthis case, heat sink device 28 may be rotated with respect to energytransfer coil 26 to removably attach heat sink device 28 to energytransfer coil 26.

In another example, the coupling mechanism may include at least oneretaining member that extends away from the housing of heat sink device28 and shaped to retain energy transfer coil 26 between the at least oneretaining member and heat sink device 28. The at least one retainingmember may be a flange, bent arm, or other member configured to bedisposed around at least a portion of energy transfer coil 26. Energytransfer coil 26 may slide within the retaining member to removablyattach heat sink device 28. Alternatively, the retaining member mayelastically deform when energy transfer coil 26 is attached to heat sinkdevice 28 such that the retaining member snaps around energy transfercoil 26.

In yet another example, the coupling mechanism may include an elasticsheath configured to retain the housing of heat sink device 28 inthermal communication with energy transfer coil 26. The elastic sheathmay be formed as a pouch or pocket configured to enclose at least aportion of both heat sink device 28 and energy transfer coil 26.Although both heat sink device 28 and energy transfer coil 26 may beremoved from the elastic sheath, either heat sink device 28 or energytransfer coil 26 may be formed within the elastic sheath. The elasticsheath may be constructed of an elastic woven material, an elasticpolymer, or other material capable of elastic deformation.

Coupling mechanisms may be disposed on heat sink device 28 and/or energytransfer device 26. Therefore, the coupling mechanism may be reversedbetween that of heat sink device 28 and energy transfer device 26. Inalternative examples, the coupling mechanism may take the form of anydevice or material that may retain heat sink device 28 against energytransfer coil 26 for a period of time. For example, the couplingmechanism may include a strap, elastic band, hook and loop closures,clamshell housing, partial polymer overmold, removable adhesive, orremovable tape. In each of these example coupling mechanisms, thematerials and/or configurations of the coupling mechanism may beselected to minimize any interference with thermal communication betweenheat sink device 28 and energy transfer device 26. The couplingmechanism may include corresponding, e.g., reciprocal, protrusions andrecesses in heat sink device 28 and energy transfer coil 26 configuredto mate and limit relative movement between the heat sink device and theenergy transfer coil.

In some examples, the phase change material of heat sink device 28 maybe disposed in one or more shapes selected to accommodate flexibility ofenergy transfer coil 26 and disposed at one or more positions withinheat sink device 28. In other words, the pattern, shape, and volume ofthe phase change material may be configured to promote flexibility ofheat sink device 28 in one or more directions and to the same degree asthat of the coil (e.g., the phase change material may be configured todeform with energy transfer coil 26). In this manner, the phase changematerial size and/or shape may not inhibit (or only minimally inhibit)flexibility of the flexible coil. This configuration of the phase changematerial may be directed to when the phase change material is in thesolid state (e.g., when temperatures of energy transfer device 26 belowthe melting point of the phase change material). Alternatively, theflexibility of heat sink device 28 due to the configuration of the phasechange material may allow heat sink device 28 to conform to the shape ofenergy transfer coil 26 and create a greater contact area that promotesthermal communication. In this manner, the phase change material may bedisposed in at least one shape configured to conform to at least one ofenergy transfer coil 26 and a non-planar skin surface of patient 12.

Heat sink device 28 and energy transfer device 26 may each also includea flexible housing (not shown in FIG. 1) configured to encase the phasechange material and the coil of wire, respectively. The flexiblehousing, e.g., a means for encasing the phase change material orflexible coil, may be constructed of a flexible material that does notrestrict the flexibility of the phase change material or coil. In otherwords the flexible housing may have an elasticity greater than or equalto the elasticity of the phase change material or coil. Thus, in someexamples, heat sink device 28 and/or energy transfer coil 26 may beconfigured to conform to a non-planar skin surface.

The flexible housing of both heat sink device 28 and energy transfercoil 28 may be constructed of a thermally conductive material totransfer heat between the coil and the phase change material. Thethermally conductive material of the flexible housing may includepolymers (e.g., thermally conductive elastomers), woven composites,deformable alloys, or other materials that allow the transfer of heat.In some examples, the flexible housing may include one or more channelsconfigured to contain the phase change material. These channels maycontain the phase change material to predetermined locations of heatsink device 28 to prevent pooling of the phase change material in theliquid state and retain selected shapes and positions of the phasechange material in the solid state.

In some examples, heat sink device 28 may include a containmentstructure comprising one or more channels configured to contain thephase change material. The containment structure may then be encased bythe flexible housing. The channels, in some examples, may be configuredas a plurality of cavities that each contain a portion of the phasechange material. The containment structure may include two matingportions that are filled with the phase change material and, whencombined, contain the phase change material in the channels of the twomating portions. Alternatively, a film may be applied to a surface ofthe containment structure to retain the phase change material within theone or more channels of the containment structure. In this example, thefilm may also be configured to contact the flexible coil and transferheat to the phase change material. The containment structure may beconstructed with a material having elastic properties or with a shapethat facilitates bending such that the containment structure alsoaccommodates flexibility of heat sink device 28.

In other examples, heat sink device 28 may include one or more flexibletubes configured to contain the phase change material at predeterminedlocations within the flexible housing. These predetermined locations maybe selected based upon the shape and/or mass of energy transfer coil 26.These flexible tubes may be used to contain the phase change materialsuch that the phase change material is disposed within the one or moreflexible tubes. The flexible tubes may be constructed of a polymer witha higher melting point temperature than temperatures to which energytransfer coil 26 would normally be exposed. In one example, the flexibletubes may be constructed of a thermally conductive elastomer. In otherexamples, the tube used may not be flexible. Although the tube may berigid or generally inflexible, the shape of the tube may still promotedeformation of heat sink device 28 in one or more directions.

Alternatively, or in addition to other containment techniques, heat sinkdevice 28 may include a woven material to limit the movement of fluidstate phase change material. The woven material may be constructed of anatural or synthetic fiber that promotes wicking of the phase changematerial in the liquid state. Instead of pooling within the housing ofheat sink device 28, the liquid phase change material may adhere to thewoven material. Therefore, the phase change material may be placed incontact with the woven material to retain the phase change material inthermal communication with the housing. Although the woven material maybe only encased by the housing, the woven material may also be containedby a bladder, flexible tube, or other cavity.

In another alternative example, the phase change material may beencapsulated in a plurality of beads or capsules distributed within thehousing of heat sink device 28. Each of these beads may be isolatedlocations of phase change material. Each of the beads may include phasechange material covered with a thermally conductive material, such as aninert and chemically stable polymer. The beads may promote flexibilityof heat sink device 28 because each bead may be a relatively smallvolume compared with the total volume of heat sink device 28. The beadsmay be shaped as spheres, ovoids, cubes, or other shapes selected to becontained within the flexible housing of heat sink device 28. The beadsmay generally have an outside diameter between approximately 20.0micrometers and 5.0 millimeters. In other examples, the outside diameterof the beads may be smaller than 20.0 micrometers or greater than 5.0millimeters. The dimensions of the beads may be selected based on thetotal mass or volume of phase change material required and/or thedimensions of energy transfer device 26.

In some examples, a thermally conductive material may be includedbetween heat sink device 28 and energy transfer coil 26. The thermallyconductive material may be configured to be disposed between the housingof heat sink device 28 and the housing of energy transfer coil 26. Inaddition, the thermally conductive material may be deformable to asurface of energy transfer coil 26 and a surface of the housing of heatsink device 28. In this manner, the thermally conductive material mayincrease the contact surface area between heat sink device 28 and energytransfer coil 26 such that the heat transfer rate may be increased fromenergy transfer coil 26 to heat sink device 28.

A flexible coil of energy transfer coil 26 may be formed by one or morecoils of wire. In one example the coil is formed by a wire wound into aspiral within a single plane (e.g., an in-plane spiral). This in-planespiral may be constructed with a thickness equal to the thickness of thewire, and the in-plane spiral may be capable of transferring energy withanother coil. In other examples, the coil may be formed by winding acoil into a spiral bent into a circle. However, this type of coil maynot be as thin as the in-plane spiral.

In one example, the phase change material may be disposed in adisk-shaped volume in a plane. The disk-shaped volume of phase changematerial may be a solid volume of phase change material approximatelythe same diameter of the in-plane spiral of energy transfer coil 26 andin a plane parallel with energy transfer coil 26 when heat sink device28 is removably attached to energy transfer coil 26. The phase changematerial may alternatively be disposed in a plurality of concentricrings within the housing. However, the phase change material may insteadbe formed as a spiral tube of phase change material.

In other examples, the phase change material may be disposed in a zigzagpattern within the housing of heat sink device 28. The zigzag patternmay have radial, circumferential, or transverse sections to create thezigzag pattern. These zigzag patterns may be configured to promotecurvature of heat sink device 28 in predetermined directions (e.g.,radial curvature, circumferential curvature, or transverse curvature).In other examples, the phase change material may be disposed in aplurality of cavities. In another example, the phase change material maybe disposed as a coil or rings inside the inner diameter of energytransfer coil 26 and/or outside the outer diameter of energy transfercoil 26.

Although heat sink device 28 may only be configured to be removablyattached to one side of energy transfer coil 26, multiple heat sinkdevices or a heat sink device of a surrounding shape may be disposed onopposing sides, e.g., both sides, of energy transfer coil 26 in otherexamples. The configuration of phase change material within one heatsink device disposed on one side of energy transfer coil 26 may varyfrom the configuration of phase change material within another heat sinkdevice disposed on the other side of energy transfer coil 26. Thesedifferent configurations of phase change material may be selected forheat sink device 28 to be placed between energy transfer coil 26 andskin or for heat sink device 28 to be placed on the non-skin side ofenergy transfer coil 26. In addition, the thickness and/or mass of phasechange material may be varied from one heat sink device to another. Inthis manner, heat sink device 28 may be positioned next to skin ofpatient 12 or opposite of the skin of patient 12.

FIG. 2A is a conceptual diagram of an example wound wire 29 of energytransfer coil 26 of FIG. 1. Energy transfer coil 26 is shown without theflexible housing to illustrate example windings of wire 29 into aspiral, e.g., an in-plane spiral, with an inner diameter (ID) and anouter diameter (OD). Wire 29 may have a selected number of turnsdirected to the characteristics of energy transfer with another coil,e.g., secondary coil 16 of IMD 14. In general, wire 29 may have as fewas 2 turns and as many as several hundred turns to create energytransfer coil 26. Energy transfer coil 26 may electrically couple to acharging module of charging device 22 with wire ends 31A and 31B thatmay be of any length as needed to couple with the charging module.Although wire 29 may be wound in a single layer, other examples ofenergy transfer coil 26 may include two or more layers of wire 29 woundin a spiral or circle. Energy transfer coil 26 with multiple layers ofwire 29 may also be considered to be an in-plane spiral if wire 29 isspiral wound.

Wire 29 may be constructed of any electrically conductive materialsufficient to transfer energy during inductive coupling, for example.Example materials for wire 29 may include copper, silver, gold,aluminum, nickel, or some alloy of two or more materials. Wire 29 maygenerally have a thickness between approximately 0.5 millimeters (mm)and 10 mm. In one example, wire 29 may have a thickness of approximately4.5 mm. In general, the OD of energy transfer coil 26 may be betweenapproximately 2.0 centimeters (cm) and 25 cm. The ID of energy transfercoil 26 may generally be between approximately 0.5 cm and 20 cm. In oneexample, energy transfer coil 26 may have an OD of approximately 10 cmand an ID of approximately 5 cm. In other examples, the dimensions ofenergy transfer coil 26 and wire 29 may be outside of these ranges forcertain applications. In some examples, wire 29 may be covered ininsulation that coats the wire. In this manner, insulation may reduceelectrical current transfer between adjacent windings of wire 29.

FIG. 2B is a conceptual diagram of example energy transfer coil 26 ofFIG. 1 and flexible (e.g., conformable) housing 35 containing a phasechange material in conjunction with non-planar skin surface 32. As shownin FIG. 2B, skin 30 includes a skin surface 32 that may not be in asingle plane. In other words, skin surface 32 may have undulations,curves, and other non-flat surfaces. Therefore, energy transfer coil 26may be flexible such that the coil can conform to skin surface 32. Anin-plane spiral of wire 29, as shown in FIG. 2A of energy transfer coil26, may allow energy transfer coil 26 to bend and flex as needed.

In this manner, the energy transfer coil 26 may be configured to conformto non-planar skin surface 32. The flexible housing of energy transfercoil 26 may also be configured to deform with the coil. In addition,heat sink device 28 may include flexible housing 35 to deform withenergy transfer coil 26. The phase change material within heat sinkdevice 28 may be disposed in one or more shapes selected to accommodateflexibility of energy transfer coil 26. Flexible housing 35 may alsoinclude retaining members 33A and 33B for removably attaching heat sinkdevice 28 to energy transfer coil 26. Retaining members 33A and 33B maybe similar to retaining members 214A and 214B of FIGS. 12A and 12B. Inthis manner, the coupling mechanism of retaining members 33A and 33B maypartially surround energy transfer coil and retain the phase changematerial in thermal communication with energy transfer coil 26.Retaining members 33A and 33B may snap in place around thecircumferential edge of energy transfer coil 26 or otherwise bend toaccept energy transfer coil 26 and exert a force against energy transfercoil 26.

FIGS. 3A through 10B illustrate example configurations of phase changematerial within a heat sink device and the relationship between the heatsink devices and energy transfer coils. However, no coupling mechanismsare provided in FIGS. 3A through 10B for ease of illustration. Instead,FIGS. 11A through 16B provide example coupling mechanisms that couldconfigured to couple any heat sink device to any energy transfer coil.FIGS. 3A and 3B are cross-sectional top and side views of phase changematerial 42 disposed as a phase change material spiral in conjunctionwith energy transfer coil 48. Heat sink device 34 is an example of heatsink device 28 of FIG. 1, and energy transfer coil 48 is an example ofenergy transfer coil 26 of FIG. 1. As shown in FIG. 3A, heat sink device34 includes phase change material 42. FIG. 3A shows heat sink device 34with housing 46 removed to expose phase change material 42. Wire coil 40is shown as a solid component in FIG. 3B for ease of illustration, butwire coil 40 may be an in-plane spiral of multiple wire turns similar tothat of energy transfer coil 26 of FIG. 2A. The wire of wire coil 40 mayextend from coil 40 to a charging circuit via connector portion 38. Inother examples, separate wires may be coupled to coil 40 to transfer orreceive electrical current from the charging circuit. Wire coil 40 andthe connection of wire coil 40 to a charging circuit may be similar tothe energy transfer coils 53, 74, 83, 99, 136, 156, 176, 183, 222, 233,252, 273, and 293 described herein.

Heat sink device 34 includes phase change material 42 disposed in acontinuous spiral. The continuous spiral of phase change material 42 maypromote flexibility of heat sink device 34. The continuous spiral ofphase change material 42 may also create a large surface area of whichmay absorb heat from energy transfer coil 48. Although phase changematerial 42 is shown with eight turns in the spiral, other examples mayinclude fewer or greater numbers of turns. In addition, phase changematerial 42 may be configured as a single layer spiral, as shown inFIGS. 3A and 3B, or as multiple spiral layers.

FIG. 3B is an illustration of a cross-section of heat sink device 34 andenergy transfer coil 48 indicated by section 3B in FIG. 3A. Flexiblecoil 40 is shown encased by housing 36. Housing 36 may be rigid orflexible. The thickness of heat sink device 34 may be similar to that ofthe thickness to that of energy transfer coil 48. For example, thethickness may be between approximately 0.5 millimeters (mm) and 10 mm.In one example, the thickness may be approximately 5.0 mm.

Heat sink device 34 may also include one or more flexible tubes, such asflexible tube 44. Flexible tube 44 may be configured to contain phasechange material 42 at the predetermined location within housing 46. Inthis manner, phase change material 42 may be disposed within flexibletube 44 such that flexible tube 44 may be a casing for the phase changematerial. Flexible tube 44 may be constructed of a thermally conductiveelastomer that is chemically inert to phase change material 42 andchemically stable. Flexible tube 44 may function to retain phase changematerial 42 if phase change material 42 changes to the liquid state. Inaddition, housing 46 that encases phase change material 42 and flexibletube 44 may be rigid or flexible.

In some examples, heat sink device 34 may include a woven materialplaced in contact with phase change material 42. The woven material maybe used to retain phase change material 42 in thermal communication withhousing 46 because the phase change material 42 may wick to the wovenmaterial when in the liquid state. This woven material may be used inaddition to, or instead of, flexible tube 44.

In other examples, heat sink device 34 may incorporate phase changematerial 42 encapsulated in a plurality of beads distributed withinhousing 46. These beads of phase change material may be disposed in asingle plane or in a greater volume of housing 46. The individual beadsmay take the place of the tubes of phase change material. Each of thebeads may include a polymer coating around phase change material 42 toretain the phase change material in the shape of the bead. In thismanner, both flexible tube 44 and beads may be means for containingphase change material 42 at predetermined locations within housing 46.In alternative examples, housing 46 may include ridges or channels thatextend across the thickness of heat sink device 34 to functionallycontain phase change material 42 within predetermined locations of heatsink device 34.

FIGS. 4A and 4B are cross-sectional top and side views of phase changematerial 58 disposed in a plurality of concentric rings in conjunctionwith energy transfer coil 53. Heat sink device 50 is an example of heatsink device 28 of FIG. 1, and energy transfer coil 53 is an example ofenergy transfer coil 26 of FIG. 1. As shown in FIG. 4A, heat sink device50 includes phase change material 58. FIG. 4A shows heat sink device 50with housing 59 removed to expose phase change material 58. Wire coil 56is shown as a solid component in FIGS. 4A and 4B for ease ofillustration, but wire coil 56 may be an in-plane spiral of wire similarto that of wire 29 of FIG. 2A.

Heat sink device 50 includes phase change material 58 disposed in aplurality of concentric rings in a single plane. The concentric ringsmay be separated (e.g., by a void or other material) or in contact witheach other. The concentric rings of phase change material 58 may resideagainst housing 59 to promote thermal communication between housing 59and energy transfer coil 53 and phase change material 58. In the exampleof FIG. 4A, heat sink device 50 includes eight rings of phase changematerial 58. Phase change material 58 may be disposed in as few as onering in another example or as many as 20 or more concentric rings onother examples. Multiple heat sink devices 50 may be disposed on oneside of energy transfer coil 53 or on both opposing sides of energytransfer coil 53 in other examples.

FIG. 4B is an illustration of a cross-section of heat sink device 50indicated by section 4B in FIG. 4A. Heat sink device 50 is shown withphase change material 58 within and encased by housing 59 and adjacentto energy transfer coil 53. The thickness of heat sink device 50 may besimilar to the thickness of the wire in coil 56, but the thickness ofheat sink device 50 may be less or greater in other examples. Althoughthe spaces between the rings of phase change material 58 may be filledwith air or other gas, the spaces may instead be filled with a thermallyconductive fluid or deformable material. Housing 52 of energy transferdevice 53 encases coil 56.

Similar to heat sink device 34 of FIG. 3B, heat sink device 50 may alsoinclude one or more flexible tubes, beads, or a woven material tocontain phase change material 58 at predetermined locations withinhousing 59. In some examples, housing 59 may include one or morechannels configured to contain phase change material 58. The channelsmay be formed by ridges that extend inward. In other examples, heat sinkdevice 50 may include a containment structure that includes one or morechannels configured to contain phase change material 58. A film may thenbe applied to a surface of the containment structure to retain phasechange material 58 within the one or more channels. The film may bethermally conductive and contact an inner surface of housing 59.Alternative to the film, the containment structure may include multipleportions that separate to receive phase change material 58 and seal toretain the phase change material within heat sink device 50.

FIGS. 5A and 5B are cross-sectional top and side views of phase changematerial disposed inside an inner diameter and outside an outer diameterof energy transfer coil 74. Heat sink device 60 is an example of heatsink device 28 of FIG. 1, and energy transfer coil 74 is an example ofenergy transfer coil 26 of FIG. 1. As shown in FIG. 5A, heat sink device60 includes phase change material disposed in inner rings 68 and outerrings 70. Energy transfer coil 74 includes connector portion 54. FIG. 5Ashows heat sink device 60 with the top of housing 72 removed to exposethe phase change material in inner rings 68 and outer rings 70. Flexiblecoil 66 is shown as a solid component in FIG. 5B for ease ofillustration, but coil 66 may be an in-plane spiral of wire similar tothat of energy transfer coil 26 of FIG. 2A.

Heat sink device 60 includes phase change material disposed in aplurality of rings that may be disposed in the same plane as energytransfer coil 74. More specifically, the phase change material isdisposed within rings inside the inner diameter of energy transfer coil74 and outside the outer diameter of energy transfer coil 74. Innerrings 68 include the phase change material disposed inside the innerdiameter of energy transfer coil 74. In addition, outer rings 70 includethe phase change material disposed outside the outer diameter of energytransfer coil 74. Although FIGS. 5A and 5B illustrates two inner rings68 and two outer rings 70, other examples of heat sink device 60 mayinclude a single inner ring and a single outer ring, or more than twoinner and outer rings. In addition, the number of inner rings 68 may bedifferent than the number of outer rings 70. In other examples, aspiral, or coil, of phase change material may be disposed in place ofinner rings 68 and/or outer rings 70.

FIG. 5B is an illustration of a cross-section of heat sink device 60indicated by section 5B in FIG. 5A. Energy transfer coil 74 includeswire coil 66 within housing 62. Heat sink device 60 is shown with phasechange material disposed in inner rings 68 and outer rings 70 to thesides of and adjacent to energy transfer coil 74. Housing 72 is alsoprovided to encase inner rings 68 and outer rings 70. The thickness ofheat sink device 60 and attached energy transfer coil 74 may be onlyslighter greater than the thickness of energy transfer coil 74 becausethe phase change material is disposed in generally the same plane asenergy transfer coil 74.

Similar to heat sink device 34 of FIG. 3B, heat sink device 60 may alsoinclude one or more flexible tubes, beads, or a woven material tocontain the phase change material if rings 68 and 70 at predeterminedlocations within housing 72. In some examples, housing 72 may includeone or more channels configured to contain the phase change material. Inother examples, a containment structure and/or a film may be used tocontain the phase change material at the inner and outer diameterlocations with respect to energy transfer coil 74.

FIGS. 6A, 6B, and 6C are cross-sectional top and side views of a phasechange material disposed in disk-shaped volume 88 in conjunction withenergy transfer coil 83. Heat sink device 80 is an example of heat sinkdevice 28 of FIG. 1, and energy transfer coil 83 is an example of energytransfer coil 26 of FIG. 1. As shown in FIG. 6A, heat sink device 80includes phase change material disposed in disk-shaped volume 88 (e.g.,a doughnut shaped volume). Energy transfer coil 83 includes coil 86,housing 82, and connector portion 84. FIG. 6A shows heat sink device 80with housing 87 removed to expose disk-shaped volume 88 of phase changematerial. Coil 86 is shown as a solid component in FIGS. 6B, and 6C forease of illustration, but coil 86 may be an in-plane spiral of wiresimilar to that of energy transfer coil 28 of FIG. 2A.

Heat sink device 80 includes phase change material disposed indisk-shaped volume 88 in a plane that may be placed adjacent andgenerally parallel to energy transfer coil 83. Disk-shaped volume 88 maybe disposed such that the large flat surface area of disk-shaped volume88 is positioned to contact housing 87 and the flat surface area ofenergy transfer coil 83. The increased contact area between disk-shapedvolume 88 of heat sink device 80 and flexible coil 83 may increase thethermal communication to the phase change material and improve the heatmanagement of energy transfer coil 83. Disk-shaped volume 88 may have athickness and diameter slightly less than that of energy transfer coil83. In other examples, disk-shaped volume 88 may have a thickness anddiameter equal to or greater than energy transfer coil 83.

FIG. 6B is an illustration of a cross-section of heat sink device 80Aindicated by section 6B in FIG. 6A. Heat sink device 80A is one exampleof disk-shaped volume 88. Heat sink device 80A is shown with phasechange material disposed disk-shaped volume 88 encased by housing 87.Heat sink device 80A is also disposed on top of, and adjacent to, energytransfer coil 83. The thickness of heat sink device 80A may be lesser orgreater than the thickness of coil 86. Housing 82 is provided by energytransfer coil 83 to encase coil 86.

Similar to heat sink device 34 of FIG. 3B, heat sink device 80A may alsoinclude a flexible tube or bladder to contain the phase change materialin disk-shaped volume 88. This flexible tube may be a thermallyconductive material that is also flexible. In some examples, theflexible tube or bladder may include compartments or sections thatprevent movement of the phase change material in the liquid state.

In alternative examples, housing 87 may include one or more channelsconfigured to contain the phase change material or a containmentstructure and/or a film may be used to contain the phase change materialin the disk-shaped volume 88. Housing 87 may then encase the containmentstructure for disk-shaped volume 88 of the phase change material. Inanother example, disk-shaped volume 88 may be filled with a plurality ofindividual beads that each contain phase change material.

FIG. 6C is an illustration of a cross-section of heat sink device 80Bindicated by section 6B in FIG. 6A. FIG. 6C may be similar to FIG. 6B;however, heat sink device 80B may also include woven material 89 toretain the phase change material within disk-shaped volume 88. Wovenmaterial 89 may be constructed of a natural or synthetic fiber thatpromotes wicking of the phase change material in the liquid state.Instead of pooling within disk-shaped volume 88 or within housing 87,the liquid phase change material may adhere to woven material 89 viacapillary action or other molecular forces. Therefore, the phase changematerial may be placed in contact with woven material 89 to retain thephase change material in thermal communication with housing 87 andenergy transfer coil 83. Although woven material 89 may be only encasedby housing 87, woven material 89 may also be contained by a bladder,flexible tube, film, or other cavity.

FIGS. 7A and 7B are cross-sectional side views of phase change material96 disposed on one side and opposing sides of energy transfer coil 112.Heat sink devices 91 and 114 are examples of heat sink device 28 of FIG.1, and energy transfer coil 99 is an example of energy transfer coil 26of FIG. 1. As shown in FIG. 7A, heat sink device 91 includes phasechange material 96 in a spiral configuration. In addition, heat sinkdevice 91 is removably attached to one side of energy transfer coil 98.In this manner, heat sink device 91 and energy transfer coil 99 may be apart of system 90. In other examples, phase change material 96 may becontained within flexible tubes, channels, beads, or any othercontainment structure. Wire coil 98 is also shown as an in-plane spiralof wire. Similar to other energy transfer coils described herein, wiresmay be coupled to opposite ends of the in-plane spiral such that thecharging circuit can drive electrical current through wire coil 98.Phase change material 96 may be retained in housing 92 of heat sinkdevice 91, and wire coil 98 may be retained within housing 94 of energytransfer coil 99. Housings 92 and 94 may be formed separately andremovably attached with one or more coupling mechanisms. Housings 92 and94 may also be flexible and/or facilitate thermal communication betweenwire coil 98 and phase change material 96.

As shown in FIG. 7B, system 100 includes heat sink devices 101 and 114removably attached to energy transfer coil 99. Heat sink devices 101 and114 include phase change material 108 and 110 disposed on opposing sidesof wire coil 112 (e.g., a coil of multiple turns of wire). Heat sinkdevice 101 includes phase change material 108 in a spiral configurationwithin housing 102 on one side of energy transfer coil 99. In addition,phase change material 110 is included in a spiral configuration on theopposing side of energy transfer coil 112 within housing 106 of heatsink device 114. Phase change material 108 and 110 may be containedwithin flexible tubes, channels, beads, or any other containmentstructure. Wire coil 112 is also shown as an in-plane spiral of wire.Phase change materials 108 and 110 may be retained in housings 102 and106, respectively. Wire coil 112 may be retained within housing 104.Housings 102, 104, and 106 may include at least part of a couplingmechanism in some examples. Housings 102, 104, and 106 may also beflexible and/or facilitate thermal communication between flexible coil112 and phase change materials 108 and 110.

In the examples of FIGS. 7A and 7B, phase change materials 96, 108, and110 may each be contained within channels of the respective flexiblehousings 92, 102, and 106. These channels may not require the use of anyother material to contain or retain the phase change material. However,additional containment structures, e.g., flexible tubes, may also beincluded within the channels. Although the channels are illustrated witha circular cross-section, the channels may be constructed of any shape.For example, the channels have square, rectangular, oval, orunsymmetrical cross-sections.

FIGS. 8A and 8B are cross-sectional side views of a phase changematerial disposed in radial zigzag pattern 128 in conjunction withenergy transfer coil 136. Heat sink device 120 is an example of heatsink device 28 of FIG. 1, and energy transfer coil 136 is an example ofenergy transfer coil 26 of FIG. 1. As shown in FIG. 8A, heat sink device120 includes phase change material in radial zigzag pattern 128. Energytransfer coil 136 includes connector portion 124 for coupling coil 126with a charging device. FIG. 8A shows heat sink device 120 with the topof housing 134 removed to expose radial zigzag pattern 128 on top of, oradjacent to, energy transfer coil 136. Wire coil 126 is shown as a solidcomponent in FIG. 8B for ease of illustration, but coil 126 may be anin-plane spiral of wire similar to that of energy transfer coil 26 ofFIG. 2A.

Energy transfer device 120 includes phase change material disposed inradial zigzag pattern 128 disposed within a plane. Radial zigzag pattern128 includes radial sections 129A that extend between the inner andouter diameter of heat sink device 120 and circumferential sections 129Bthat extend around the circumference of heat sink device 120. Thisconfiguration of radial zigzag pattern 128 may be configured to promotecurvature of heat sink device 120 in predetermined directions. Forexample, radial zigzag pattern 128 may promote flexibility or curvatureof heat sink device 120 across the circumference of heat sink device120. In other words, heat sink device 120 may more easily deform at anycircumferential position across the center of heat sink device 120.

As shown in FIG. 8A, radial zigzag pattern 128 includes 16 radialsegments 129A and 16 circumferential sections 129B. However, radialzigzag pattern 128 may include fewer or greater radial andcircumferential sections in other example. A radial zigzag pattern 128with more segments may increase the mass of phase change material inheat sink device 120 that in turn provides a larger heat sink for energytransfer coil 136. The phase change material in radial zigzag pattern128 may reside flat within heat sink device 120 to promote thermalcommunication between energy transfer coil 136 and the phase changematerial. Radial zigzag pattern 128 may be disposed on one side ofenergy transfer coil 136 or on both opposing sides of energy transfercoil 136 in other examples.

FIG. 8B is an illustration of a cross-section of heat sink device 120indicated by section 8B in FIG. 8A. Heat sink device 120 is shown withthe phase change material of radial zigzag pattern 128 within housing134. The thickness of heat sink device 120 may be less than, equal to,or greater than the thickness of the wire in wire coil 126. Housing 122encases wire coil 126 separate from the phase change material of radialzigzag pattern 128.

Radial zigzag pattern 128 may be formed by channels within containmentstructure 132. Containment structure 132 may be constructed of athermally conductive or thermally insulative material that is alsoflexible. Film 130 may be applied to the surface of containmentstructure 132 to retain the phase change material within the channels ofcontainment structure 132. Film 130 may be adhered to containmentstructure 132 with an adhesive or other bonding technique. Film 130 mayalso be configured to contact housing 134 and transfer heat to the phasechange material in radial zigzag pattern 128. Alternatively, containmentstructure 132 may include two mating portions that are filled with thephase change material and, when combined, contain the phase changematerial in the channels of the two mating portions.

Similar to heat sink device 34 of FIG. 3B, heat sink device 120 mayalternatively include one or more flexible tubes, beads, or a wovenmaterial to contain the phase change material in radial zigzag pattern128 at predetermined locations with within housing 134. In otherexamples, radial zigzag pattern 128 may be formed in one or morechannels or cavities of housing 134.

FIGS. 9A and 9B are cross-sectional side views of a phase changematerial disposed in lateral zigzag pattern 148 in conjunction withenergy transfer coil 156. Heat sink device 140 is an example of heatsink device 28 of FIG. 1, and energy transfer coil 156 is an example ofenergy transfer coil 26 of FIG. 1. As shown in FIG. 9A, heat sink device140 includes phase change material in lateral zigzag pattern 148. Energytransfer coil 156 includes connector portion 144 for coupling coil 146with a charging device. FIG. 9A shows heat sink device 140 with the topof housing 154 removed to expose lateral zigzag pattern 148 on top of,or adjacent to, energy transfer coil 156. Wire coil 146 is shown as asolid component in FIG. 9B for ease of illustration, but coil 146 may bean in-plane spiral of wire similar to that of energy transfer coil 26 ofFIG. 2A.

Heat sink device 140 includes phase change material disposed in lateralzigzag pattern 148 adjacent to energy transfer coil 156. Lateral zigzagpattern 148 may be similar to radial zigzag pattern 128 of FIG. 8A, butlateral zigzag pattern 148 traverses the interior surface of heat sinkdevice 140 from one side edge of heat sink device 140 to the other side.This configuration of lateral zigzag pattern 148 may be configured topromote curvature of heat sink device 140 and energy transfer coil 156in predetermined directions when heat sink device 140 and energytransfer coil 156 are removably attached. For example, lateral zigzagpattern 148 may promote flexibility or curvature of heat sink device 140in a single direction across the heat sink device 140. In other words,lateral zigzag pattern 148 may promote curling of heat sink device 140from the endpoints of lateral zigzag pattern 148 toward the middle ofheat sink device 140. In other examples, lateral zigzag pattern 148 maybe oriented in any direction within housing 154 of heat sink device 140.Lateral zigzag pattern 148 may include any number of sections to coverless or more area of heat sink device 140 with phase change material.Lateral zigzag pattern 148 may be disposed on one side of energytransfer coil 156 or on both opposing sides of energy transfer coil 156in other examples.

FIG. 9B is an illustration of a cross-section of heat sink device 140indicated by section 9B in FIG. 9A. Heat sink device 140 is shown withthe phase change material of lateral zigzag pattern 148 within housing154. The thickness of heat sink device 140 may be less than, equal to,or greater than the thickness of energy transfer coil 156. Housing 154may thus encase the phase change material of lateral zigzag pattern 148and housing 142 may this encase wire coil 146 of energy transfer coil156.

Similar to radial zigzag pattern 128 of FIG. 8B, lateral zigzag pattern148 may be formed by channels within containment structure 152. Film 150may be provided to seal the phase change material within the channels ofcontainment structure 152. Containment structure 152 may be constructedof a thermally conductive or thermally insulative material that is alsoflexible. Film 150 may be applied to the surface of containmentstructure 152 to retain the phase change material within the channels ofcontainment structure 152. Film 130 may be adhered to containmentstructure 152 with an adhesive or other bonding technique. Film 150 mayalso be configured to contact housing 154 and transfer heat to the phasechange material in lateral zigzag pattern 148 from energy transfer coil156 when attached. Alternatively, containment structure 152 may includetwo mating portions that are filled with the phase change material and,when combined, contain the phase change material in the channels of thetwo mating portions.

Similar to energy transfer device 34 of FIG. 3B, heat sink device 140may alternatively include one or more flexible tubes, beads, or a wovenmaterial to contain the phase change material in lateral zigzag pattern148 at predetermined locations within housing 154. In other examples,lateral zigzag pattern 148 may be formed in one or more channels orcavities of housing 154.

FIGS. 10A and 10B are cross-sectional side views of a phase changematerial disposed in a plurality of self-contained volumes 168distributed in conjunction with energy transfer coil 176. Heat sinkdevice 160 is an example of heat sink device 28 of FIG. 1, and energytransfer coil 176 is an example of energy transfer coil 26 of FIG. 1. Inaddition, heat sink device 160 may be very similar to heat sink device140 of FIGS. 9A and 9B. However, heat sink device 160 may include aplurality of self-contained volumes 168 instead of a continuous zigzagpattern. Heat sink device 160 includes phase change material inself-contained volumes 168. Energy transfer coil 176 may include wirecoil 166, housing 162, and connector portion 164. The phase changematerial of self-contained volumes 168 may be provided within housing174 (not shown in FIG. 10A). Volumes 168 may, in effect, form multiple,discrete islands of phase change material distributed across the area ofheat sink device 160.

Self-contained volumes 168 may be any depression, cavity, orencapsulated volume that contains phase change material. For example,self-contained volumes 168 may be a plurality of individual beads orcapsules. Each of the beads or capsules may include phase changematerial encapsulated with a thermally conductive material, such as aninert and chemically stable polymer. Many small volumes of phase changematerial may prevent phase change material from pooling or migratingwhen the phase change material is heated to the liquid state. Manyself-contained volumes 168 may also promote flexibility of heat sinkdevice 160. Heat sink device 160 may include any number ofself-contained volumes 168. In general, heat sink device 160 may includeas few as two self-contained volumes or more than one hundredself-contained volumes. Self-contained volumes 168 may be distributed ina grid, concentric circles, a random pattern, or any other patternselected to perform the functions described herein.

FIG. 10B is an illustration of a cross-section of heat sink device 160and energy transfer coil 176 indicated by section 10B in FIG. 10A. Heatsink device 160 is shown with the phase change material ofself-contained volumes 168 within housing 174 and energy transfer coil176 is shown with wire coil 166 within housing 162. Housing 174 and 162may be constructed of a flexible material that reduces any inhibition offlexibility of coil 166 and/or self-contained volumes 168 when heat sinkdevice 160 is removably attached to energy transfer coil 176.

Self-contained volumes 168 may be formed as cavities or depressionswithin containment structure 172. Film 170 may be provided to seal thephase change material within the cavities of containment structure 172.Containment structure 172 may be constructed of a thermally conductiveor thermally insulative material that is also flexible. Film 170 may beapplied to the surface of containment structure 172 to retain the phasechange material within the cavities of containment structure 172. Film150 may be adhered to containment structure 152 with an adhesive orother bonding technique. Film 170 may also be configured to contact theinterior of housing 174 to transfer heat from energy transfer coil 176to the phase change material in self-contained volumes 168.Alternatively, containment structure 172 may include two mating portionsthat are filled with the phase change material and, when combined,contain the phase change material in the channels of the two matingportions. Self-contained volumes 168 may be shaped as spheres, cubes,domes, or any other shapes.

Similar to heat sink device 34 of FIG. 3B, heat sink device 160 mayalternatively include one or more flexible tubes, beads, or a wovenmaterial to contain the phase change material in self-contained volumes168 at predetermined locations within housing 174. In other examples,self-contained volumes 168 may be formed in one or more cavities ordepressions of housing 174. Alternatively, self-contained volumes 168may each be a bead or other encapsulation structure that retains thephase change material.

FIGS. 11A and 11B include a top view and a cross-sectional side view ofsystem 180 that includes heat sink device 181 removably attached toenergy transfer coil 183 with threaded member 184. Heat sink device 180is an example of heat sink device 28 of FIG. 1, and energy transfer coil183 is an example of energy transfer coil 26 of FIG. 1. As shown in FIG.11A, heat sink device 181 includes a disk-shaped housing 182 withthreaded member 184 disposed at the center of housing 182. Heat sinkdevice 181 may be removably attached to an energy transfer coil tomanage the temperature of the energy transfer coil during a rechargesession. Threaded member 184 may be at least a portion of the couplingmechanism used to attach heat sink device 181 to energy transfer coil183.

Heat sink device 181 is shown as a disc or circular shaped structure.However, heat sink device 181 may be configured into any shapeappropriate for absorbing heat from energy transfer coil 183. In otherexamples, heat sink device 181 may have an oval, triangular, square,rectangular, or amorphous shape. The shape of heat sink device 181 maybe selected to increase the contact area between heat sink device 181and energy transfer coil 183.

FIG. 11B is an illustration of a cross-section of heat sink device 181and energy transfer coil 183 indicated by section 11B in FIG. 11A.Together, heat sink device 181 and energy transfer coil 183 may beconsidered system 180. Energy transfer coil 183 may include wire coil200, housing 186, and retaining block 198 that includes threaded surface197. Wire coil 200 may include second windings of a coil. The windingsmay be within a plane (e.g., an in-plane spiral of wire). Wire coil 200may include one or more layers of coil windings. The number of windingsin wire coil 200 may be selected based on the energy to be transferredwhen charging IMD 14, the thickness of the wire, and the flexibilitydesired for a particular application.

Housing 186 may contain wire coil 200. In some examples, housing 186 maybe constructed of a flexible material that conforms to non-planar skinsurfaces. Housing 186 may also be thermally conductive such that heatgenerated within wire coil 200 can be transmitted to phase changematerial 190. In addition, housing 186 may include or be attached toretaining block 198. Retaining block 198 may be disposed within thecenter of housing 186 and provide a receptacle for threaded member 184.Specifically, retaining block 198 may include threaded surface 197configured to mate with threaded structure 196 of threaded member 184.In this manner, both retaining block 198 and threaded member 184 may beportions of a coupling mechanism configured to retain at least a portionof housing 182 in thermal communication with a surface of housing 186 ofenergy transfer coil 183. In other examples, threaded surface 197 may beformed directly in housing 186.

Heat sink device 181 may include phase change material 190, housing 182,and threaded member 184 (e.g., a coupling mechanism). Housing 182 may beshaped to contain phase change material 190 within the interior volume(e.g., a disk-shaped volume similar to disk-shaped volume 88 of heatsink device 80 in FIGS. 6A, 6B, and 6C) of housing 182. Housing 182 mayalso be constructed of a flexible material that deforms to the surfaceof energy transfer coil 183 and/or the skin surface of patient 14.

Housing 182 may also be shaped to include threaded member 184. Housing182 may form a center hole configured to accept threaded member 184.Threaded member 184 may include knob 192, shaft 194, and threadedstructure 196. A user may apply pressure to either side of knob 192 andexert a torque about threaded member 184 to unscrew or screw threadedstructure 196 against threaded surface 197. The torque applied to knob192 may be transmitted down shaft 194 and to threaded structure 196 toattach or remove heat sink device 181 from energy transfer coil 183. Inother examples, threaded member 184 may be a separate component that ismerely provided as part of system 180 to removably attach heat sinkdevice 180 to energy transfer coil 183.

In this manner, threaded member 184 may be used to removably attach heatsink device 181 to energy transfer device 183. When attached, housing182 may be in thermal communication with energy transfer coil 183 whenhousing 182 is in contact with at least a portion of the surface ofenergy transfer coil 183. In some examples, system 180 may include oneor more coupling mechanisms located at various positions with respect toheat sink device 181 and energy transfer coil 183. Multiple couplingmechanisms may be desirable to retain housings 182 and 186 in contactwith each other when energy transfer coil 186 and heat sink device 181are both flexible.

The coupling mechanism that retains heat sink 181 and energy transfercoil 183 in thermal communication may vary in other examples. Forexample, the threaded structure of heat sink device 181 may be formed byhousing 182. Housing 182 may include an extruded threaded structuresimilar to that of threaded member 184. Alternatively, housing 182 mayform a threaded surface in a depression that accepts a threadedstructure formed of or attached to housing 186 of energy transfer coil183. Alternatively, housing 182 may form a threaded structure or aseries of tabs along the outer circumference of the housing. The outercircumference threaded structure may be configured to mate with athreaded surface of housing 186 along the outer surface of energytransfer coil 26. In this case, heat sink device 181 may be rotated withrespect to energy transfer coil 183 to engage the circumferentialthreaded structure with the circumferential threaded surface such thatheat sink device 181 is removably attached to energy transfer coil 26.These circumferential threaded structures and surfaces may resemble, forexample, a lid (e.g., heat sink device 181) that screws onto a jar(e.g., energy transfer coil 183). In some examples, the couplingmechanism may include threaded surfaces and associated structures ofhousings 182 and 186 at multiple different radial positions. It is notedthat any coupling mechanisms described herein may be formed from ahousing, attached to a housing, or otherwise configured to couple to ahousing.

FIGS. 12A and 12B include a top view and a cross-sectional side view ofheat sink device 211 removably attached to energy transfer coil 222 withtwo retaining members 214A and 214B. Heat sink device 211 is an exampleof heat sink device 28 of FIG. 1, and energy transfer coil 222 is anexample of energy transfer coil 26 of FIG. 1. As shown in FIG. 12A, heatsink device 211 includes a disk-shaped housing 212 with retainingmembers 214A and 214B (collectively “retaining members 214”). Heat sinkdevice 211 may be removably attached to energy transfer coil 222 tomanage the temperature of the energy transfer coil during a rechargesession.

Each of retaining members 214 may be arms that extend away from thesurface of housing 212 and are shaped to retain energy transfer coil 222between retaining members 214 and housing 212. Retaining members 214 mayinclude a curved length that corresponds to the circumference of housing212 and/or the circumference of energy transfer coil 222. In addition,retaining members 214 may include a lip indicated by the dotted linesthat ends radially inward at the end of each retaining member. Retainingmembers 214 may be at least a portion of the coupling mechanism used toattach heat sink device 211 to energy transfer coil 222.

Heat sink device 211 is shown as a disc or circular shaped structure.However, heat sink device 211 may be configured into any shapeappropriate for absorbing heat from energy transfer coil 222. In otherexamples, heat sink device 211 may have an oval, triangular, square,rectangular, or amorphous shape. The shape of heat sink device 211 maybe selected to increase the contact area between heat sink device 222and energy transfer coil 222. In this manner, any heat sink devicesdescribed herein may be configured with dimensions and/or a shapeselected to absorb heat from one or more energy transfer coils.

FIG. 12B is an illustration of a cross-section of heat sink device 211and energy transfer coil 222 indicated by section 12B in FIG. 12A.Together, heat sink device 211 and energy transfer coil 222 may beconsidered as system 210. Energy transfer coil 222 may include wire coil222 and housing 218. Wire coil 220 may be substantially similar to wirecoil 200 of FIG. 11B. Housing 218 of energy transfer coil 222 maycontain wire coil 220. In some examples, housing 218 may be constructedof a flexible material that conforms to non-planar skin surfaces.Housing 218 may also be thermally conductive such that heat generatedwithin wire coil 220 can be transmitted to phase change material 216.

Heat sink device 211 may include phase change material 216, housing 212,and retaining members 214 (e.g., a coupling mechanism). Housing 212 maybe shaped to contain phase change material 216 within the interiorvolume (e.g., a disk-shaped volume similar to disk-shaped volume 88 ofheat sink device 80 in FIGS. 6A, 6B, and 6C) of housing 212. Housing 212may also be constructed of a flexible material that deforms to thesurface of energy transfer coil 222 and/or the skin surface of patient14.

Retaining members 214 may be constructed as curved arms configured tomatch the curvature of the outside of housing 218. In other examples,retaining members 214 may extend completely around the edge of housing218 or housing 218 may include three or more retaining members 214positioned equidistant around the edge of housing 218 or at varyingcircumferential positions. In some examples, retaining members 214 maybe shaped with angular bends instead of the curvature shown in FIG. 12B.For example each of retaining members 214 may be shaped like an “L”. Inany example, retaining members 214 may be constructed of a material thatdeforms radially outward such that each retaining member 214 “snaps”into place around the edges of housing 218. In this manner, retainingmember 214 may provide elastic deformation that allows radial changingpositions, e.g., at least some degree of flexibility, to accept housing218. In some examples, retaining members 214 may be biased to form adiameter between the retaining members that is smaller than the diameterof housing 218. This bias may then provide a force against housing 218such that energy transfer coil 22 is retained between retaining members214 and against heat sink device 211. Although retaining members 214 maybe formed of housing 212, retaining members 214 may be separate elementsattached to housing 212 in other examples.

In this manner, retaining members 214 may be used to removably attachheat sink device 211 to energy transfer coil 222. When attached, housing211 may be in thermal communication with energy transfer coil 222 whenhousing 211 is in contact with at least a portion of the surface ofenergy transfer coil 222. In some examples, heat sink device 211 mayinclude three or more retaining members in other examples. Multiplecoupling mechanisms may be desirable to retain housings 211 and 222 incontact with each other when energy transfer coil 222 and heat sinkdevice 211 are both flexible.

FIGS. 13A and 13B include a perspective view and a cross-sectional sideview of heat sink device 231 removably attached to energy transfer coil233 with elastic sheath 236. Heat sink device 231 is an example of heatsink device 28 of FIG. 1, and energy transfer coil 233 is an example ofenergy transfer coil 26 of FIG. 1. As shown in FIG. 13A, heat sinkdevice 231 includes a disk-shaped housing 234. Heat sink device 231 maybe removably attached to energy transfer coil 233 with elastic sheath236 to manage the temperature of energy transfer coil 233 during arecharge session.

Elastic sheath 236 may be formed as a pouch or pocket configured toenclose at least a portion of both heat sink device 231 and energytransfer coil 233 and function as a coupling mechanism. Although bothheat sink device 231 and energy transfer coil 233 may be removed fromthe elastic sheath, either heat sink device 231 or energy transfer coil233 may be formed within, e.g., permanently within, the elastic sheathin other examples. The opening in elastic sheath 236 may be formed alongthe circumferential edge of the sheath such that each of heat sinkdevice 231 may be slide sideways into the sheath. Alternatively, elasticsheath 236 may include an opening on the bottom or top of elastic sheath236 such that each of heat sink device 231 and energy transfer coil 233may be placed into elastic sheath 236 one at a time in a stackingconfiguration. Elastic sheath 236 may also provide a hole or otheraccess panel that allows a wire or cable to exit the elastic sheath.Elastic sheath 236 may be constructed of an elastic woven material, anelastic polymer, or other material capable of elastic deformation. Heatsink device 231 is shown as a disc or circular shaped structure.However, heat sink device 231 may be configured similar to heat sinkdevice 211 of FIGS. 12A and 12B into any shape appropriate for absorbingheat from energy transfer coil 233.

FIG. 13B is an illustration of a cross-section of heat sink device 231and energy transfer coil 233 indicated by section 13B in FIG. 13A.Together, heat sink device 231 and energy transfer coil 233 may beconsidered as system 230. Energy transfer coil 233 may include wire coil242 and housing 232. Wire coil 242 may be substantially similar to wirecoil 200 of FIG. 11B. Housing 232 of energy transfer coil 233 maycontain wire coil 242. In some examples, housing 232 may be constructedof a flexible material that conforms to non-planar skin surfaces.Housing 232 may also be thermally conductive such that heat generatedwithin wire coil 242 can be transmitted to phase change material 238.

Heat sink device 231 may include phase change material 238 and housing234. Housing 234 may be shaped to contain phase change material 238within the interior volume (e.g., a disk-shaped volume similar todisk-shaped volume 88 of heat sink device 80 in FIGS. 6A, 6B, and 6C) ofhousing 234. Housing 234 may also be constructed of a flexible materialthat deforms to the surface of energy transfer coil 233 and/or the skinsurface of patient 14. Elastic sheath 236 may thus be used by the userto removably attach heat sink device 231 to energy transfer coil 233.Elastic sheath 236 may undergo elastic deformation sufficient to add andremove at least one of heat sink device 231 and energy transfer coil233.

In addition, thermally conductive material 240 may be provided tofacilitate heat transfer between energy transfer coil 233 and heat sinkdevice 231. Thermally conductive material 240 may have a thickness thatis at least partially deformable to increase the surface area contactbetween housings 234 and 232. Thermally conductive material 240 may beconstructed of a polymer, composite, adhesive, or any other materialthat facilitates the transfer of heat. Although thermally conductivematerial 240 may be a separate element in system 230, thermallyconductive material 240 may be attached to or otherwise a part of eitherhousing 234 or housing 232. In other examples, heat sink device 231 maybe thermally coupled to energy transfer device 233 without thermallyconductive material 240.

In other examples, elastic sheath 236 may be replaced with analternative device that connects heat sink device 231 and energytransfer coil 233. For example, system 230 may utilize a strap, buttontabs, a fabric pouch, adhesive tape, or any other structure that wrapsat least partially around heat sink device 231 and energy transfer coil233. In alternative examples, heat sink device 231 and energy transfercoil 233 may be coupled with a coupling mechanism that includes a hookand loop closure device (e.g., hooks may be disposed on a surface ofheat sink device 231 and loops may be disposed on a surface of energytransfer coil 231).

FIGS. 14A and 14B include a top view and a side view of a heat sinkdevice 260 removably attached to energy transfer coil 252 in conjunctionwith skin 258 of patient 14. Heat sink device 260 is an example of heatsink device 28 of FIG. 1, and energy transfer coil 252 is an example ofenergy transfer coil 26 of FIG. 1. As shown in FIG. 14A, system 250includes energy transfer coil 252 retained within clip 254. Energytransfer coil 252 may include an oval shaped housing that includes acoil of wire used to wirelessly transfer energy. Clip 254 may beconfigured such that energy transfer coil 252 fits within clip 254 forattachment to patient 14. Clip 254 is then retained against patient 14with belt 256. Belt ends 256A and 256B couple to clip 254 and are a partof belt 256 that wraps around portion of the body of patient 14. In thismanner, clip 254 and belt 256 may be a coupling mechanism.

As shown in FIG. 14B, system 250 also includes heat sink device 260removably attached to energy transfer coil 252 between energy transfercoil 252 and skin 258. Heat sink device 260 may be attached to energytransfer coil 260 by the pressure from energy transfer coil 252 againstskin 258. In other words, belt 256 may retain clip 254 and energytransfer coil 252 against skin 258. Then heat sink device 260 may bepositioned between energy transfer coil 252 and skin 258. In otherexamples, heat sink device 260 may be positioned between clip 254 andenergy transfer coil 252. In any case, heat sink device 260 may includephase change material that absorbs heat from energy transfer coil 252when the housing of heat sink device 260 is in contact (e.g., thermalcommunication) with energy transfer coil 252.

Heat sink device 260 may include phase change material configuredsimilar to any phase change material of various heat sink devices 260described herein. Heat sink device 260 may be shaped as a circular disk,oval disk, rectangular pad, or any other shape that may or may not bematched with the shape of energy transfer coil 252. In addition, heatsink device 260 may be attached energy transfer coil 252 with anadhesive or a tacky surface of a polymer housing of heat sink device260. The housing and phase change material of heat sink device 260 mayalso be configured to be flexible such that heat sink device 260 mayconform to skin 258 and/or energy transfer coil 252.

FIGS. 15A and 15B include a top view and a cross-sectional side view ofheat sink devices 271A and 271B removably attached to energy transfercoil 273 with elastic sheath 274. Heat sink devices 271A and 271B(collectively “heat sink devices 271”) are examples of heat sink device28 of FIG. 1, and energy transfer coil 273 is an example of energytransfer coil 26 of FIG. 1. More specifically, heat sink devices 271 maybe substantially similar to heat sink device 231 of FIGS. 13A and 13B.In addition, elastic sheath 274 may be substantially similar to elasticsheath 236 of FIGS. 13A and 13B.

As shown in FIG. 15A, heat sink device 271A is a disk-shaped deviceconfigured to mate against energy transfer coil 273. With the aid ofelastic sheath 274 (e.g., a coupling mechanism), heat sink device 271Amay be removably attached to energy transfer coil 273. Since elasticsheath 236 may force heat sink device 271A into thermal communicationwith energy transfer coil 273, heat sink device 271A may manage thetemperature of energy transfer coil 273 during a recharge session.

Elastic sheath 274 may be formed as a pouch or pocket configured toenclose at least a portion of both heat sink devices 271 and energytransfer coil 273 and function as a coupling mechanism. Both heat sinkdevices 271 and energy transfer coil 273 may be removed from elasticsheath 274. Although heat sink devices 271 and energy transfer coil 273may be designed and configured to mate with each other, heat sinkdevices 271 and elastic sheath 274 may be constructed as an aftermarketsystem to manage the temperature of previously manufactured energytransfer coil 273. In this manner, heat sink devices 271 and elasticsheath 274 may be used with a variety of different energy transfer coilsfor different applications and from different manufacturers. Other heatsink devices described herein may also be retroactively applied toenergy transfer coils not originally configured to mate with a heat sinkdevice.

FIG. 15B is an illustration of a cross-section of heat sink devices 271and energy transfer coil 273 indicated by section 15B in FIG. 15A. Heatsink devices 271 may be positioned on opposing sides of energy transfercoil 273. In addition, elastic sheath 274 is shown as surrounding heatsink devices 271 and energy transfer coil 273. Together, heat sinkdevices 271, energy transfer coil 273, and elastic sheath 274 may beconsidered as system 270. Energy transfer coil 273 may include a wirecoil (not shown) within housing 272. Housing 272 may also be thermallyconductive such that heat generated during the recharge session can betransmitted to phase change material 280A and 280B.

Heat sink devices 271 may include phase change material 280A and 280Bwithin respective housings 278A and 278B. Similar to other heat sinkdevices described herein, phase change material 280A and 280B may becontained within flexible tubes, beads, channels, or larger volumes.Housings 278A and 278B may also be constructed of a flexible materialthat deforms to the surface of energy transfer coil 273 and/or the skinsurface of patient 14. Elastic sheath 274 may thus be used by the userto removably attach heat sink devices 271 to energy transfer coil 273.Elastic sheath 274 may undergo elastic deformation sufficient to add andremove at least one of heat sink devices 271 and energy transfer coil273.

FIGS. 16A and 16B include a top view and a cross-sectional side view ofheat sink device 291 removably attached to energy transfer coil 293 witha retaining member. Heat sink device 291 is an example of heat sinkdevice 28 of FIG. 1, and energy transfer coil 273 is an example ofenergy transfer coil 26 of FIG. 1. As shown in FIG. 16A, heat sinkdevice 281 is a device configured to mate against energy transfer coil293. Energy transfer coil 293 may be a wireless energy transfer coil. Inother words, energy transfer coil 293 may be a self-contained chargingdevice that includes an energy source and a charging circuit to driveelectrical current through wire of a primary coil within energy transfercoil 293. Alternatively, energy transfer coil 293 may be tethered to acharging device (e.g., charging device 22 of FIG. 1). Heat sink device291 may include both a phase change material and a coupling mechanismthat retains heat sink device 291 in thermal communication with energytransfer coil 293. Heat sink device 291 may be configured to mate withenergy transfer coil 293, but energy transfer coil 293 may not have beendesigned to be coupled with heat sink device 291. Both heat sink device291 and energy transfer coil 293 may be shaped as a rectangle with oneside being shaped as a half-circle.

FIG. 16B is an illustration of a cross-section of heat sink device 291and energy transfer coil 293 indicated by section 16B in FIG. 16A. Heatsink device 291 and energy transfer coil 293 may be included withinsystem 290. Energy transfer coil 293 may include a wire coil (not shown)within housing 292. Housing 292 may also be thermally conductive suchthat heat generated during the recharge session can be transmitted tophase change material 298 of heat sink device 291.

Heat sink device 291 may include phase change material 298 containedwithin housing 294. Similar to other heat sink devices described herein,phase change material 298 may be contained within flexible tubes, beads,channels, or larger continuous volumes. Housing 294 may also be formedwith retaining member 296 that extends away from housing 294. Retainingmember 296 may have a curved inner surface configured to mate with thecurved outer surface of housing 292 of energy transfer coil 293. In thismanner, retaining member 296 may be shaped to at least partiallysurround housing 292 to removably attach heat sink device 291 to energytransfer coil 293.

Retaining member 296 may be a continuous structure around the perimeterof housing 294. In other examples, retaining member 296 may include twoor more segments that are spaced around the circumference of housing294. As shown in FIG. 16A, energy transfer coil 293 may be slid alonghousing 294 and between opposing surfaces of retaining member 296 toremovably attach heat sink device 291 to energy transfer coil 293. Inthis manner, retaining member 296 may be constructed of a rigid materialor a flexible material. Alternatively, retaining member 296 may beconstructed of a flexible material that allows retaining member 296 toflex outward to accept energy transfer coil 293 and “snap” back intoposition to retain the energy transfer coil in contact with heat sinkdevice 291. Although retaining member 296 may be formed of housing 294,retaining member 296 may be a separate structure attached to housing 294in other examples. Housing 294 may include one or more alternativeretaining members that allows energy transfer coil 293 to be attached toheat sink device 291 at different approach angles than shown in FIGS.16A and 16B.

As described herein, heat sink devices may be attached to energytransfer devices and then removed when no longer needed. In this manner,a housing of a heat sink device may be removably attached to an energytransfer coil. The energy transfer coil may be configured to recharge arechargeable power source of an implantable medical device and thehousing may contain a phase change material configured to absorb heatfrom the energy transfer coil.

In one example, removably attaching the housing to the energy transfercoil may include rotating a threaded structure of the heat sink devicehousing against a threaded surface of the energy transfer coil until thehousing is in thermal communication with the energy transfer coil. Inanother example, removably attaching the housing of the heat sink deviceto the energy transfer coil may include radially bending at least oneretaining member of the housing and disposing the energy transfer coilbetween the at least one retaining member of the heat sink device andthe housing. Such a technique may include snapping the energy transfercoil within the retaining members of the heat sink device. In analternative example, removably attaching the housing of the heat sinkdevice to the energy transfer coil may include retaining the housing andthe energy transfer coil within an elastic sheath such that the housingof the heat sink device is in thermal communication with the energytransfer coil.

According to the techniques and devices described herein, phase changematerial may be provided in contact with an energy transfer coil tomanage the temperature of the coil during a charging session. The phasechange material may be disposed within a housing such that heat isconducted to the phase change material. In addition, the phase changematerial may be configured to be positioned between the skin of apatient and the energy transfer coil, on the opposite side of the energytransfer coil than the skin, or some combination thereof. Further, thephase change material may be retained within predetermined locationswithin the housing of the heat sink device such that the phase changematerial does not interfere with or otherwise reduce any flexibility ofthe energy transfer coil.

Various examples have been described. These and other examples arewithin the scope of the following claims.

What is claimed is:
 1. A device comprising: a phase change materialconfigured to absorb heat from an energy transfer coil; a housingconfigured to contain the phase change material; and a couplingmechanism configured to removably attach the housing to the energytransfer coil.
 2. The device of claim 1, wherein the coupling mechanismis configured to retain at least a portion of the housing in thermalcommunication with a surface of the energy transfer coil.
 3. The deviceof claim 1, wherein the coupling mechanism comprises a threadedstructure configured to mate to a threaded surface of the energytransfer coil.
 4. The device of claim 1, wherein the coupling mechanismcomprises at least one retaining member that extends away from thehousing and is shaped to retain the energy transfer coil between the atleast one retaining member and the housing.
 5. The device of claim 1,wherein the coupling mechanism comprises an elastic sheath configured toretain the housing in thermal communication with the energy transfercoil.
 6. The device of claim 1, wherein the phase change material isdisposed in at least one shape configured to conform to at least one ofthe energy transfer coil and a non-planar skin surface of a patient. 7.The device of claim 1, wherein the housing comprises one or morechannels configured to contain the phase change material.
 8. The deviceof claim 1, further comprising one or more flexible tubes configured tocontain the phase change material at predetermined locations within thehousing, wherein the phase change material is disposed within the one ormore flexible tubes.
 9. The device of claim 8, wherein at least one ofthe one or more flexible tubes and the housing is constructed of athermally conductive elastomer.
 10. A system comprising: an energytransfer coil configured to recharge a rechargeable power source of animplantable medical device; and a housing containing a phase changematerial and configured to be removably attached to the energy transfercoil, wherein the phase change material is configured to absorb heatfrom the energy transfer coil.
 11. The system of claim 10, wherein thehousing is in thermal communication with the energy transfer coil whenthe housing is in thermal communication with a surface of the energytransfer coil.
 12. The system of claim 10, wherein the energy transfercoil comprises a threaded surface, and wherein the housing comprises athreaded structure configured to mate to the threaded surface of theenergy transfer coil.
 13. The system of claim 10, wherein the housingcomprises at least one retaining member that extends away from thehousing and is shaped to retain the energy transfer coil between the atleast one retaining member and the housing.
 14. The system of claim 10,further comprising an elastic sheath configured to retain the housing inthermal communication with the energy transfer coil.
 15. The system ofclaim 10, further comprising a thermally conductive material configuredto be disposed between the housing and the energy transfer coil, whereinthe thermally conductive material is deformable to a surface of theenergy transfer coil and a surface of the housing.
 16. The system ofclaim 10, further comprising an implantable medical device comprisingthe rechargeable power source and a secondary coil, wherein thesecondary coil is configured to transcutaneously receive power from theenergy transfer coil.
 17. A method comprising: removably attaching ahousing to an energy transfer coil, wherein the energy transfer coil isconfigured to recharge a rechargeable power source of an implantablemedical device and the housing contains a phase change materialconfigured to absorb heat from the energy transfer coil.
 18. The methodof claim 17, wherein removably attaching the housing to the energytransfer coil comprises rotating a threaded structure of the housingagainst a threaded surface of the energy transfer coil until the housingis in thermal communication with the energy transfer coil.
 19. Themethod of claim 17, wherein removably attaching the housing to theenergy transfer coil comprises radially bending at least one retainingmember of the housing and disposing the energy transfer coil between theat least one retaining member and the housing.
 20. The method of claim17, wherein removably attaching the housing to the energy transfer coilcomprises retaining the housing and the energy transfer coil within anelastic sheath such that the housing is in thermal communication withthe energy transfer coil.